【英文标准名称】:Attachmentmaterialsforelectronicassembly.Requirementsforelectronicgradesolderalloysandfluxedandnon-fluxedsolidsoldersforelectronicsolderingapplications
【原文标准名称】:电子组件用连接材料.电子焊接用电子级钎焊合金及有焊剂和无焊剂的固体焊料用要求
【标准号】:BSEN61190-1-3-2007+A1-2010
【标准状态】:现行
【国别】:英国
【发布日期】:2007-07-31
【实施或试行日期】:2007-07-31
【发布单位】:英国标准学会(GB-BSI)
【起草单位】:BSI
【标准类型】:()
【标准水平】:()
【中文主题词】:合金;应用;组件;化学成分;分类;组分;连接设备;定义(术语);名称与符号;电气工程;电子工程;架设(施工作业);助熔剂(材料);检验;无铅;金属含量;合格;质量;质量保证;分规范;焊接合金;焊剂;钎焊;焊锡;规范(验收);试验
【英文主题词】:Alloys;Applications;Assemblies;Chemicalcomposition;Classification;Composition;Connectingdevices;Definitions;Designations;Electricalengineering;Electronicengineering;Erecting(constructionoperation);Fluxes(materials);Inspection;Leadfree;Metalcontent;Qualifications;Quality;Qualityassurance;Sectionalspecification;Solderalloys;Solderingpastes;Solderings;Solders;Specification(approval);Testing
【摘要】:ThispartofIEC61190prescribestherequirementsandtestmethodsforelectronicgradesolderalloys,forfluxedandnon-fluxedbar,ribbon,powdersoldersandsolderpaste,forelectronicsolderingapplicationsandfor“special”electronicgradesolders.Forthegenericspecificationsofsolderalloysandfluxes,seeISO9453,ISO9454-1andISO9454-2.Thisstandardisaqualitycontroldocumentandisnotintendedtorelatedirectlytothematerial'sperformanceinthemanufacturingprocessSpecialelectronicgradesoldersincludeallsolderswhichdonotfullycomplywiththerequirementsofstandardsolderalloysandsoldermaterialslistedherein.Examplesofspecialsoldersincludeanodes,ingots,preforms,barswithhookandeyeends,multiple-alloysolderpowders,etc.
【中国标准分类号】:J33
【国际标准分类号】:31_190
【页数】:40P.;A4
【正文语种】:英语